Published May 3, 2018 | Version v1
Patent Open

Method of Forming Topcoat for Patterning

Description

Disclosed is a method for the fabrication of polymeric topcoat via initiated chemical vapor deposition (iCVD) or photoinitiated chemical vapor deposition (piCVD) in conjunction with directed self-assembly (DSA) of block copolymers to generate high resolution patterns. A topcoat deposited by iCVD or piCVD allows for conformal, ultra-thin, uniform, pinhole-free coatings. iCVD or piCVD topcoat enables the use of a diversity of block copolymer (BCP) materials for DSA and facilitates the direct and seamless integration of the topcoats for a pattern transfer process.

Files

US20180122648.pdf

Files (1.8 MB)

Name Size Download all
md5:61d9a28de71a71d14aa3ad76f191ac45
1.8 MB Preview Download

Additional details

Identifiers

Patent application number
US 201715685609 A
Patent number
US 2018/0122648 A1
Other
oai:uchicago.tind.io:7923

Dates

Patent filed
2017-08-24

UChicago Information

Division(s)
Pritzker School of Molecular Engineering