Published August 25, 2020 | Version v1
Patent Open

Method of forming topcoat for patterning

Description

Disclosed is a method for the fabrication of polymeric topcoat via initiated chemical vapor deposition (iCVD) or photoinitiated chemical vapor deposition (piCVD) in conjunction with directed self-assembly (DSA) of block copolymers to generate high resolution patterns. A topcoat deposited by iCVD or piCVD allows for conformal, ultra-thin, uniform, pinhole-free coatings. iCVD or piCVD topcoat enables the use of a diversity of block copolymer (BCP) materials for DSA and facilitates the direct and seamless integration of the topcoats for a pattern transfer process.

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Additional details

Identifiers

Patent number
US 10755942 B2
Patent application number
US 201715685609 A
Other
oai:uchicago.tind.io:7373

Dates

Patent filed
2017-08-24

UChicago Information

Division(s)
Pritzker School of Molecular Engineering